Lam Research Corporation, a global supplier of wafer fabrication equipment, announced that its Aether® dry photoresist technology has been selected by a leading memory manufacturer for the most advanced DRAM processes. This technology, introduced in 2020, enhances the resolution, productivity, and yield of Extreme Ultraviolet (EUV) lithography, crucial in next-generation semiconductor production.
Aether® overcomes challenges in transferring fine DRAM designs to a wafer, providing high precision with low defects, cost efficiency, and sustainability benefits. The memory manufacturer will use Aether® tools in its advanced DRAM nodes, utilizing dry resist underlayers and films for improved patterning processes that reduce costs and enhance productivity in semiconductor manufacturing.
The adoption of EUV lithography is essential for scaling memory capacity for energy and compute-intensive applications, with Lam’s dry photoresist technology optimizing the patterning process and offering sustainability advantages. Aether® enhances EUV sensitivity and resolution, improving wafer adherence and overall performance, while consuming less energy and chemicals compared to traditional wet chemical processes.
Lam Research Corporation continues to prioritize innovation and collaboration with industry leaders to drive advancements in semiconductor manufacturing. With a strong commitment to customers and a values-based culture, Lam Research is at the forefront of providing cutting-edge solutions in the semiconductor industry. For more information, visit www.lamresearch.com.
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